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cld-ds16 rev 11a product family data sheet cree ? xlamp ? mc-e led www. cree.com/xlamp copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ? , the cree logo, xlamp ? and easywhite ? are are registered trademarks of cree, inc. product description the xlamp m c-e le d is a family of lighting-class, multi-chip l eds that provides high lumen output in a small package. compared to discrete l e ds, xlamp m c-e le ds reduce the distance between le d die, creating a small optical source for excellent optical control and effcient color mixing. xlamp m c-e le ds can reduce le d system complexity by reducing the number of components required. cree xlamp l e ds bring high performance and quality of light to a wide range of lighting applications, including color-changing lighting, portable and personal lighting, outdoor lighting, indoor directional lighting, and entertainment lighting. features ? available in white (2600 k C 10,000 k cct), easywhite ? , dynamic white, or color (rgbw) ? ansi-compatible neutral & warm white chromaticity bins ? individually addressable leds ? m c-e dynamic white leds have two cool-white (6500 k) and two warm-white (2700 k) led die ? m c-e easywhite leds available in 2 and 4-step bins, up to 85 cri ? m aximum drive current: 700 ma per led die ? refow solderable C jedec j-std-020 ? e lectrically neutral thermal path ? rohs-compliant ? ul-recognized component (e349212) cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 table of contents characteristics complete p ackage .................. 2 p er led die (white) ................ 2 p er led die (color) ................. 2 flux characteristics white .................................... 3 easywhite ............................. 4 relative spectral p ower distribution white .................................... 5 color ..................................... 5 relative flux output vs junction temperature ................. 6 e lectrical characteristics ............. 7 relative intensity vs. current ...... 7 typical spatial radiation p attern .. 8 refow soldering characteristics .. 9 notes ...................................... 10 mechanical dimensions .............. 12 tape and reel .......................... 13 p ackaging ................................ 14 mc-e white mc-e color mc-e dynamic white
2 characteristics - complete package the following table lists the product characteristics for the xlamp m c-e led package. characteristics unit minimum typical maximum thermal resistance, junction to solder point - white c/w 3 thermal resistance, junction to solder point - color c/w 4 viewing angle (fwhm) - white degrees 110 viewing angle (fwhm) - color degrees 115 e sd withstand voltage (hbm per m il-std-883d) v 8000 led junction temperature c 150 characteristics - per led die (white, easywhite, dynamic white) the following table lists the product characteristics of each individual l e d die within the xlamp m c-e w hite le d package. characteristics unit minimum typical maximum temperature coeffcient of voltage mv/c -4 dc forward current ma 700 reverse v oltage v 5 forward v oltage (@ 350 ma) v 3.1 3.9 forward v oltage (@ 700 ma) v 3.4 characteristics - per led die (color) the following table lists the product characteristics for each l ed die within the xlamp m c-e color led package. characteristics unit red green blue white temperature coeffcient of voltage mv/c typical -2 -4 -4 -4 dc forward current ma maximum 700 700 700 700 reverse v oltage v maximum 5 5 5 5 forward v oltage (@ 350 ma) v typical 2.1 3.4 3.2 3.1 maximum 2.5 3.9 3.9 3.9 forward v oltage (@ 700 ma) v typical 2.3 3.7 3.5 3.5 copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
3 flux characteristics - white, dynamic white, color (t j = 25 c) the following tables provide several base order codes for xlamp m c-e . it is important to note that the base order codes listed here are a subset of the total available order codes for the product family. for more order codes, as well as a complete description of the order-code nomenclature, please consult the xlamp m c-e binning and labeling document. part color cct / dominant wavelength range base order codes min. luminous flux @ 350 ma* order code min. max. group flux (lm) white cool white 5000 k 10,000 k k 370 mce4w t-a2-0000-000k01 m 430 mce4w t-a2-0000-000m01 neutral white 3700 k 5000 k j 320 mce4wt-a2-0000-000je4 k 370 mce4w t-a2-0000-000ke4 w arm white 2600 k 3700 k g 240 mce4w t-a2-0000-000ge7 h 280 mce4w t-a2-0000-000he7 j 320 mce4wt-a2-0000-000je7 dynamic white 2 cool-white die 6500 k k 100 mced w t-a1-0000-0000a1001 2 warm-white die 2700 k g 70 2 cool-white die 6000 k k 100 mced w t-a1-0000-0000a1002 2 warm-white die 2700 k g 70 color red 620 nm 630 nm a5 30.6 mce 4ct-a2-0000-00a5aaaa1 green 520 nm 535 nm 67.2 blue 450 nm 465 nm 8.2 cool white 5700 k 7000 k 100 red 620 nm 630 nm a4 30.6 mce 4ct-a2-0000-00a4aaab1 green 520 nm 535 nm 67.2 blue 450 nm 465 nm 8.2 neutral white 3700 k 4300 k 80 notes: ? cree maintains a tolerance of 7% on fux and power measurements, 0.005 on chromaticity (ccx, ccy) measurements, 2 on cri measurements and 1 nm on dominant wavelength measurements. ? typical cri for cool white and neutral white (3700 k - 10,000 k cct) is 75. ? typical cri for warm white (2600 k - 3700 k cct) is 80. ? flux and chromaticity are measured with each led die connected to independent drive circuits at 350 ma. the fux and chromaticity of xlamp mc-e white are measured with all leds lit simultaneously. the fux and color of each led in xlamp m c-e dynamic white and m c-e color are measured individually. copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
4 flux characteristics - easywhite mc-e leds (t j = 25 c) the following table provides order codes for xlamp m c-e easyw hite le ds. for a complete description of the order-code nomenclature, please consult the xlamp m c-e binning and labeling document. color cct range base order codes min. luminous flux @ 350 ma, 25 c 2-step order code 4-step order code group flux (lm) chromaticity region chromaticity region standard cri easywhite 4000 k k 370 40h mceezw -a1-0000-0000k040h 40f mceezw -a1-0000-0000k040f j 320 mceezw-a1-0000-0000j040h mceezw-a1-0000-0000j040f 3500 k j 320 35h mceezw-a1-0000-0000j035h 35f mceezw-a1-0000-0000j035f h 280 mceezw -a1-0000-0000h035h mceezw -a1-0000-0000h035f 3000 k j 320 30h mceezw-a1-0000-0000j030h 30f mceezw-a1-0000-0000j030f h 280 mceezw -a1-0000-0000h030h mceezw -a1-0000-0000h030f 2700 k j 320 27h mceezw-a1-0000-0000j027h 27f mceezw-a1-0000-0000j027f h 280 mceezw -a1-0000-0000h027h mceezw -a1-0000-0000h027f 80-cri minimum easywhite 4000 k k 370 40h mceezw -h1-0000-0000k040h 40f mceezw -h1-0000-0000k040f j 320 mceezw-h1-0000-0000j040h mceezw-h1-0000-0000j040f 3500 k j 320 35h mceezw-h1-0000-0000j035h 35f mceezw-h1-0000-0000j035f h 280 mceezw -h1-0000-0000h035h mceezw -h1-0000-0000h035f 3000 k j 320 30h mceezw-h1-0000-0000j030h 30f mceezw-h1-0000-0000j030f h 280 mceezw -h1-0000-0000h030h mceezw -h1-0000-0000h030f 2700 k j 320 27h mceezw-h1-0000-0000j027h 27f mceezw-h1-0000-0000j027f h 280 mceezw -h1-0000-0000h027h mceezw -h1-0000-0000h027f 85-cri minimum easywhite 3000 k h 280 30h mceezw -p1-0000-0000h030h 30f mceezw -p1-0000-0000h030f g 240 mceezw -p1-0000-0000g030h mceezw -p1-0000-0000g030f 2700 k h 280 27h mceezw -p1-0000-0000h027h 27f mceezw -p1-0000-0000h027f g 240 mceezw -p1-0000-0000g027h mceezw -p1-0000-0000g027f notes: ? for standard cri parts, the typical cri is 80 for 4000 and 3500 k cct parts and typical cri is 82 for 3000 and 2700 k cct. ? cree maintains a tolerance of 7% on fux and power measurements, 0.005 on chromaticity (ccx, ccy) measurements and 2 on cri measurements. ? flux and chromaticity are measured with each l e d die connected to independent drive circuits at 350 ma and with all le ds lit simultaneously. copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
5 relative spectral power distribution (i f = 350 ma per led) - white the following graph represents typical spectral output of the xlamp m c-e w hite le d with all four le ds on simultaneously. relative spectral power distribution (i f = 350 ma per led) - color the following graph represents typical spectral output of the xlamp m c-e color le d with all four le ds on simultaneously. relative spectral power distribution (if = 350 ma per led) - white the following graph represents typical spectral output of the xlamp mc-e white led with all four leds on simultaneously. 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) 5000k - 10000k cct 3700k - 5000k cct 2600k - 3700k cct relative spectral power distribution (if = 350 ma per led) - color the following graph represents typical spectral output of the xlamp mc-e color led with all four leds on simultaneously. 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) rgbw (6000k) rgbw (4000k) copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
6 relative spectral power distribution (i f = 350 ma per led) - color (continued) the following graph represents typical spectral output of the xlamp m c-e color led with each le d on independently. relative flux output vs junction temperature (i f = 350 ma) the following graph represents typical performance of each l ed die in the xlamp m c-e le d. the following graph represents typical spectral output of the xlamp mc-e color led with each led on independently. 0 20 40 60 80 100 400 450 500 550 600 650 700 750 relative radiant power (%) wavelength (nm) red green blue white (6000k) white (4000k) relative flux output vs. junction temperature (if = 350 ma) the following graph represents typical performance of each led die in the xlamp mc-e led 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 25 50 75 100 125 150 relative luminous flux junction temperature (oc) white red green blue copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
7 electrical characteristics (t j = 25 ?c) the following graph represents typical performance of each l ed die in the xlamp m c-e le d. relative intensity vs. current (t j = 25 ?c) the following graph represents typical performance of each l ed die in the xlamp m c-e le d. electrical characteristics (tj = 25oc) the following graph represents typical performance of each led die in the xlamp mc-e led 0 100 200 300 400 500 600 700 1.5 2.0 2.5 3.0 3.5 4.0 forward current (ma) forward voltage (v) white, blue red green relative intensity vs. current (tj = 25oc) 0 20 40 60 80 100 120 140 160 180 200 0 100 200 300 400 500 600 700 relative luminous flux (%) forward current (ma) white, blue red green copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
8 typical spatial radiation pattern the following graph represents typical output of the xlamp m c-e led with all four le ds on simultaneously. typical spatial radiation pattern the following graph represents typical spectral output of the xlamp mc-e led with all four leds on simultaneously. 0 20 40 60 80 100 120 - 90 - 60 - 30 0 30 60 90 relative luminous intensity (%) angle (o) white color copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
9 reflow soldering characteristics in testing, cree has found xlamp mc-e leds to be compatible with jedec j-std-020c, using the parameters listed below. as a general guideline, cree recommends that users follow the recommended soldering profle provided by the manufacturer of solder paste used. note that this general guideline may not apply to all pcb designs and confgurations of refow soldering equipment. profle feature lead-based solder lead-free solder average ramp-up rate (ts max to tp) 3 c/second max. 3 c/second max. p reheat: temperature m in (ts min ) 100 c 150 c p reheat: temperature m ax (ts max ) 150 c 200 c preheat: time (ts min to ts max ) 60-120 seconds 60-180 seconds time m aintained above: temperature (t l ) 183 c 217c time m aintained above: time (t l ) 60-150 seconds 60-150 seconds peak/classifcation temperature (tp) 215 c 260 c time within 5 c of actual p eak temperature (tp) 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to p eak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package, measured on the package body surface. t p t l temperature time t 25?c to peak preheat ts t s t p 25 ramp-down ramp-up critical zone t l to t p ts max ts min copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
10 notes lumen maintenance projections cree now uses standardized i e s lm -80-08 and tm -21-11 methods for collecting long-term data and extrapolating led lumen maintenance. for information on the specifc lm-80 data sets available for this led, refer to the public lm-80 results document at www.cree.com/xlamp_app_notes/l m80_results. moisture sensitivity xlamp m c-e le ds are shipped in sealed, moisture-barrier bags ( m bb) designed for long shelf life. if xlamp m c-e le ds are exposed to moist environments after opening the m bb packaging but before soldering, damage to the l e d may occur during the soldering operation. the derating table at right defnes the maximum exposure time (in days) for an xlamp m c-e le d in the listed humidity and temperature conditions. le ds with exposure time longer than the time specifed below must be baked according to the baking conditions listed here. cree recommends keeping xlamp l e ds in their sealed moisture-barrier packaging until immediately prior to use. cree also recommends returning any unused l e ds to the resealable moisture-barrier bag and closing the bag immediately after use. baking conditions it is not necessary to bake all xlamp m c-e leds. only the le ds that meet all of the following criteria must be baked: ? le ds that have been removed from the original mbb packaging. ? le ds that have been exposed to a humid environment longer than listed in the m oisture sensitivity section above. ? le ds that have not been soldered. le ds should be baked at 80 oc for 24 hours. l e ds may be baked on the original reels. remove le ds from m bb packaging before baking. do not bake parts at temperatures higher than 80 oc. this baking operation resets the exposure time as defned in the moisture sensitivity section above. storage conditions xlamp m c-e le ds that have been removed from original m bb packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 5 oc and no greater than 10% rh. for l e ds stored in these conditions, storage time does not add to exposure time as defned in the above moisture sensitivity section. rohs compliance the levels of rohs restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eu directive 2011/65/ec (rohs2), as implemented january 2, 2013. rohs declarations for this product can be obtained from your cree representative or from the product e cology section of www.cree.com. temperature maximum percent relative humidity 30% 40% 50% 60% 70% 80% 90% 30 oc 9 5 4 3 1 1 1 25 oc 12 7 5 4 2 1 1 20 oc 17 9 7 6 2 2 1 copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
11 ul recognized component level 1 enclosure consideration. the led package or a portion thereof has not been investigated as a fre enclosure or a fre and electrical enclosure per ansi/ul 8750. vision advisory claim w arning. do not look at exposed l e d lamps in operation. e ye injury can result. for more information about le ds and eye safety, please refer to the cree l ed e ye safety application note (www.cree.com/xlamp_app_notes/led_eye_safety). copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
12 mechanical dimensions all measurements are .1mm unless otherwise indicated. top view bottom view side view 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh top view 9.0 .0 + .2 .80 typ. 7.50 7.00 .75 .10 1.50 bsc pitch 1 2 3 4 5 6 7 8 .05 .05 .25 1.45 r 3.18 4.48 .20 a 5.40 2.60 2.84 7.70 10.02 5.60 1.00 typ. 1.50 bsc pitch 2.75 1.16 3.85 1.30 2.00 7090mc parallel / independent configuration d8 d7 d6 d5 d4 d3 d2 d1 negative (-) 4 5 4 positive (+) 4 negative (-) 3 6 3 positive (+) 3 negative (-) 2 7 2 positive (+) 2 8 1 negative (-) 1 positive (+) 1 heatsink recommended pcb solder pad tolerances: .10 1. solder mask windows must be .05 mm bigger 2. than pcb solder pad. +.13 -.03 d1 d2 d3 d4 revisions rev comments date approved by a initial release 10/16/07 rc b change height due to new lens 10/23/2007 rc c change recommended solder pad footprint 11/26/2007 rc d height change due to new lens (was 3.86) 12/26/2007 rc e - change package height from 1.5 to 1.45 - add led reference designators - delete series configuration schematic - add tabs to recommended pcb footprint 5/12/2008 rc sheet 1 of 1 20:1 2610-00005 size title rev. c drawing no. date date date check final protective finish material approved drawn by third angle projection .x 0.3 x 2 .xx .10 .x .25 for sheet metal parts only .xx .13 x 1 unless otherwise specified dimensions are in millimeters & before finish. tolerance unless specified: scale a b c d 1 2 3 4 5 6 6 5 4 3 2 1 a b c d 4600 silicon drive durham, n.c 27703 unauthorized person without the written consent may not be copied, reproduced or disclosed to any confidential information of cree, inc. this plot contained within are the proprietary and cree confidential. this plot and the information of cree inc. notice outline drawing, 7090mc package e r.chaloupecky 10/16/07 ban loh color d1: red d2: green d3: blue d4: white recommended pcb solder p ad dynamic white d1: cool white d2: w arm white d3: cool white d4: w arm white copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
13 (200 lamps) loaded pockets (13 pockets min.) trailer 160mm (min) of empty pockets sealed with tape (34 empty pockets min.) leader 400mm (min) of empty pockets with at least 100mm sealed by tape start end cathode side anode side (denoted by chamfer) 200.0 a a b 5.5 .1 section a-a scale 2 : 1 16.0 .0 + .3 12.0 .1 1.75 .10 4.0 .1 1.5 .1 detail b scale 2 : 1 13 mm 7" cover tape pocket tape user feed direction user feed direction tape and reel all cree carrier tapes conform to e ia-481d, automated component handling systems standard. all measurements in mm. copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds
14 packaging patent label (on bottom of box) label with cree bin code, qty, reel id label with cree bin code, qty, reel id label with cree order code, qty, reel id, po # label with cree order code, qty, reel id, po # label with cree bin code, qty, reel id unpackaged reel packaged reel boxed reel cree bin code & barcode label vacuum-sealed moisture barrier bag label with customer p/n, qty, lot #, po # label with cree bin code, q t y , lot # label with cree bin code, q t y , lot # v acuum - sealed moisture barrier bag p atent label label with customer order code, q t y , r eel i d , po # humidity indicator card (inside bag) dessicant (inside bag) copyright ? 2008-2013 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree ?v , the cree logo, xlamp ? and easywhite ? are registered trademarks of cree, inc. xlamp mc-e leds

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